IEEE International Conference on

Electron Devices and Solid-State Circuits

Call For Paper

IEEE EDSSC 2020 is the 16th in a series of very successful conferences initiated by IEEE ED/SSC Hong Kong Joint Chapter. This year, EDSSC returns to Hong Kong. EDSSC 2020 continues the EDSSC tradition as a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the broad areas of electron devices and solid-state circuits and systems. The technical program includes invited talks by famous scientists and contributed papers. All accepted papers will be invited to submit to the IEEE Xplore database which will be indexed by EI Compendex.

We invite contributions describing the latest scientific and technological results in subjects including but not limited to the following:

  • 2D Materials and Devices

  • Emerging Devices 

  • Energy Devices 

  • Device Reliability 

  • Display and Imager 

  • Memory Devices  

  • MEMS and Sensors 

  • Nanoelectronics 

  • Organic Devices 

  • Oxides Electronics 

  • Perovskite Electronics

  • Photonic Devices 

  • Power Devices 

  • RF & Microwave Devices 

  • Quantum Devices

  • Analog, Amplifier and Filter Circuits

  • Biomedical Circuits 

  • Circuits for Internet-of-Things 

  • Circuits for Quantum Computing

  • Circuits for Robotics and Autonomous Transportation

  • Data Converters 

  • Digital, Memory and IO Circuits

  • Hardware Security 

  • Processors, SoCs and Machine Learning Circuits

  • Power Management Circuits 

  • RF & Microwave Circuits 

  • Sensor Interface Circuits

  • Wireline and Optical Transceivers

Important Dates

Submission Deadline: March 20, 2020

Acceptance Notification: April 20, 2020

*All submissions must be made on-line via the submission website.

Electron Devices and Solid-State Circuits 2020


Electron Devices and Solid-State Circuits 2020


 June 3rd - 5th, 2020


City University of Hong Kong​

83 Tat Chee Ave, Kowloon Tong, Hong Kong

Contact Us

To learn more, don’t hesitate to get in touch

Dr Stephen Tsang
Department of Materials Science and Engineering
City University of Hong Kong
Hong Kong, China
Tel: (852) 3442 4618

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